Effect of Interfacial IMCs Proportion on the Reliability of Miniature Lead-Free Solder Joint

Author

Wu, Fengshun ; He, Mingmin ; Wu, Yiping ; An, Bing ; Zhang, Weigang

Author_Institution

State Key Lab. of Plastic Forming Simulation & Die & Mould Technol., Huazhong Univ. of Sci. & Technol., Wuhan

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

5

Abstract

The effect of interfacial IMCs (intermetallic compounds) proportion on the reliability of miniature lead-free solder joint was studied. The miniature lead free solder joint was formed with Sn-3.5Ag-0.5Cu or Sn-3.5Ag solder alloys and two copper bars that the ends were plated with Ni and Au. Several sizes of micro-joints were gotten to measure the effect of IMCs proportion. Optical microscope (OM) was used to observe the changes of interfacial IMCs of different miniature joints. Maximal shear strength force and maximal impact force were tested to evaluate the effect of miniaturization on the reliability. The results showed that the interfacial IMCs proportion of solder joints increased when they were aged at 150degC for 0 hours, 120 hours, and 200 hours or the sizes of solder joints changed from 100 mum to 20 mum. The maximal shear strength and maximal impact force of the solder joints decreased when the interfacial IMCs proportion increased

Keywords

copper alloys; reliability; silver alloys; soldering; solders; tin alloys; 120 h; 150 C; 200 h; Au; Ni; SnAg; SnAgCu; interfacial IMC; intermetallic compound proportion; lead-free solder joint reliability; maximal impact force; maximal shear strength force; optical microscope; solder alloys; solder joint proportion; Bars; Copper alloys; Environmentally friendly manufacturing techniques; Gold alloys; Intermetallic; Lead; Nickel alloys; Optical microscopy; Size measurement; Soldering; interfacial IMCs; lead-free; miniaturization; reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359754

Filename

4198875