Study on Optimized Processing Parameters and Joint Resistance of Device during Ultrasonic Bonding

Author

Li, Mingyu ; Guan, Jingwei ; Ji, Hongjun

Author_Institution

Shenzhen Graduate Sch., Harbin Inst. of Technol., Shenzhen

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

4

Abstract

Al+1%Si wire with 25mum diameter and three kinds of pads (Au/Ni/Cu pad , Cu pad and Ni/Cu pad) are bonded by ultrasonic wedge bonding. The influence of the parameters (ultrasonic power, bonding time and bonding force) on the formation of joint are studied. Surface plot and contour plot are protracted with MINITAB, and the processing parameters are also optimized. A special circuit to test joint resistance is designed. As the variable, the parameters are used to analyse the tendency of interfacial resistance. The factors are investigated by the curve of resistance

Keywords

electric resistance; lead bonding; ultrasonic bonding; 25 micron; Al-Si; Au-Ni-Cu; Cu; MINITAB; Ni-Cu; bonding force; bonding time; contour plot; interficial resistance; joint resistance; optimized processing parameters; resistance curve; surface plot; ultrasonic bonding; ultrasonic power; ultrasonic wedge bonding; Bonding forces; Circuit testing; Copper; Gold; Integrated circuit packaging; Metallization; Optimized production technology; Temperature; Welding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359757

Filename

4198878