DocumentCode
2575778
Title
An advanced flash memory technology on SOI
Author
Burnett, D. ; Shum, D. ; Baker, K.
Author_Institution
NVM Technol. Center, Motorola Inc., Austin, TX, USA
fYear
1998
fDate
6-9 Dec. 1998
Firstpage
983
Lastpage
985
Abstract
For the first time, EEPROM functionality is demonstrated on double-poly bitcells on SOI using the same layout as standard bulk CMOS bitcells. By using FN tunneling for program and erase (P/E) operations, the P/E characteristics of the floating-body SOI bitcell are comparable to the bulk CMOS characteristics. Bitcell endurance for SOI cells show significantly less window closure than bulk CMOS cells. High-voltage SOI device characteristics are also compared with bulk devices. With sufficient body contacts, the high-voltage SOI devices can support the required bitcell voltages.
Keywords
CMOS memory circuits; flash memories; semiconductor device breakdown; silicon-on-insulator; tunnelling; EEPROM functionality; FN tunneling; HV SOI device characteristics; Si; advanced flash memory technology; bitcell endurance; body contacts; double-poly bitcells; erase characteristics; floating-body SOI bitcell; program characteristics; CMOS technology; Degradation; EPROM; Electrons; Flash memory; Hot carriers; Nonvolatile memory; Silicon; Tunneling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-4774-9
Type
conf
DOI
10.1109/IEDM.1998.746519
Filename
746519
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