Board Level Drop Test Reliability for MCP Package

Author

Zhang, Jing ; Du, Maohua ; Feng, Nufeng ; Lee, Taekoo

Author_Institution

Samsung Semicond. R&D Co. Ltd., Suzhou

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

4

Abstract

With the increasing requirement of thinner, higher density and multi-function product, MCP (multi chip package) is becoming a more and more popular package. And for application in handheld systems, the package´s resistance to drop impact becomes especially important. This study uses a simple DAQ system for the drop test according to JEDEC standard, discusses the effects of substrate pad denting, solder ball composition, and mold thickness on the reliability life, and through failure analysis the failure mechanism is explained

Keywords

ball grid arrays; failure analysis; impact testing; integrated circuit reliability; multichip modules; DAQ system; JEDEC standard; board level drop test reliability; drop impact; failure analysis; failure mechanism; handheld systems; mold thickness; multi chip package; solder ball composition; substrate pad denting; Costs; Data acquisition; Electronic equipment testing; Electronics packaging; Failure analysis; Packaging machines; Semiconductor device packaging; Stress; System testing; Test equipment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359759

Filename

4198880