Title :
Thirty-Second IEEE International Electronics Manufacturing Technology Symposium
Author :
Velandia, D.M.S. ; Conway, Paul P. ; West, Andrew A. ; Whalley, David ; Wilson, Aswathy ; Huertas, L.
Author_Institution :
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough
Abstract :
The following topics are covered:manufacturing and test technology, materials for electronics packaging, stacked die and die-attach film, imaging, medical technology, embedded technology, materials in packaging applications, materials for interconnects, lead-free soldering and bonding, lead-free soldering and MEMS, nanotechnology, environmental design.
Keywords :
electronics packaging; interconnections; microassembling; micromechanical devices; nanoelectronics; soldering; MEMS; die-attach film; electronics packaging; embedded technology; environmental design; imaging; interconnects; lead-free bonding; lead-free soldering; manufacturing; medical technology; nanotechnology; packaging applications; stacked die film; test technology;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-1335-5
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2007.4417038
