Title :
Low Temperature and Ultra Fine Pitch Joints Using Non-Conductive Adhesive for Flip Chip Technology
Author :
Kim, Soo Yeol ; Oh, Tae-Sung ; Lee, Won Jong ; Kim, Young-Ho
Author_Institution :
Dept. of Mater. Sci. & Eng., Hanyang Univ., Seoul
Abstract :
The low temperature and ultra fine pitch chip on glass (COG) bonding using non-conductive adhesive (NCA) was developed. 30 mum pitch Sn bumps on Si chip were bonded with the metal pads on the glass substrate at 80 degC. Reflowed Sn bumps were used to reduce the NCA trapping. The initial contact resistance of the bump joints at 80 MPa pressure was less than 30 mOmega, which was lower than that of the joints using anisotropy conductive film (ACF). Aging treatment at 85 degC slightly decreased the contact resistance. Failed COG joints were not observed before and after aging
Keywords :
adhesive bonding; adhesives; ageing; contact resistance; fine-pitch technology; flip-chip devices; glass; silicon; tin; 30 micron; 80 C; 80 MPa; 85 C; Si; Sn; aging treatment; anisotropy conductive film; chip on glass bonding; contact resistance; flip chip technology; glass substrate; nonconductive adhesive; ultra fine pitch joints; Aging; Anisotropic magnetoresistance; Bonding; Contact resistance; Flip chip; Glass; Nonconductive adhesives; Substrates; Temperature; Tin;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359782
