Three Dimensional Flow Analysis During Injection Molding Process For Stacked-Die Packages

Author

Moon, Sung-Won ; Yang, Cheng ; Li, Zhihua ; Fischer, Anthony

Author_Institution

Intel Corp., Chandler, AZ

fYear

2007

fDate

3-5 Oct. 2007

Firstpage

20

Lastpage

23

Abstract

The three-dimensional numerical simulation has been performed to study mold flow characteristics during injection molding process of stacked die packages. The modeling results revealed that flow front shape is highly non-uniform around the die stack-up units and is dependent on various design parameters including mold cap clearance, mold compound material properties, as well as the die stack-up geometric configurations. It was demonstrated that validated flow model can help guiding the design, material, and process optimization of 3D packaging development.

Keywords

chip scale packaging; flow simulation; injection moulding; integrated circuit manufacture; die stack-up units; flow model; geometric configurations; injection molding process; stacked chip scale package; stacked die packages; three dimensional flow analysis; three-dimensional numerical simulation; Design optimization; Electronics packaging; Encapsulation; Equations; Filling; Injection molding; Performance analysis; Process design; Solid modeling; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International

Conference_Location

San Jose, CA

ISSN

1089-8190

Print_ISBN

978-1-4244-1335-5

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2007.4417049

Filename

4417049