DocumentCode :
2576463
Title :
Equipment grounding conductors and bonding: a vital link in electrical system protection
Author :
Ockuly, George J.
Author_Institution :
Bussman Cooper Ind., St. Louis, MO, USA
fYear :
1989
fDate :
10-11 Apr 1989
Firstpage :
56
Lastpage :
60
Abstract :
Electrical equipment grounding and bonding conductors must be sized to withstand the maximum fault currents imposed during abnormal system conditions. It is noted that many low-voltage distribution systems do not contain adequately sized equipment grounding conductors and bonding jumpers, compromising personnel and system safety. It is emphasized that proper consideration of conductor withstand ratings provides improved equipment grounding, system reliability, and safety. Examples are presented which illustrate the engineering and design issues associated with proper selection and sizing of the equipment grounding conductor and associated bonding conductors. Particular consideration is given to insulated conductor withstand ratings, bare conductor withstand ratings, and conductor sizing using a current-limiting device. It is concluded that it is the responsibility of the design engineer to comply with the National Electrical Code requirements as well as to understand the nuances of proper electrical protection associated with component and equipment withstandability
Keywords :
conductors (electric); earthing; power system protection; safety; standards; LV distribution systems; National Electrical Code; abnormal system conditions; bare conductor withstand ratings; bonding conductors; bonding jumpers; conductor sizing; current-limiting device; electrical system protection; grounding conductors; insulated conductor withstand ratings; maximum fault currents; personnel safety; reliability; system safety; Bonding; Conductors; Design engineering; Fault currents; Grounding; Insulation; Personnel; Protection; Reliability engineering; Safety devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Engineering Problems in the Rubber and Plastics Industries, 1989., IEEE Conference Record of 1989 Forty-First Annual Conference of
Conference_Location :
Akron, OH
Type :
conf
DOI :
10.1109/RAPCON.1989.47716
Filename :
47716
Link To Document :
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