Title :
The Design and Fabrication of Microlens and LED Integrated Packaging
Author :
Wang, Dianming ; Chen, Sihai ; Wang, Ming ; Xiang, Sihua
Author_Institution :
Inst. of Optoelectronic Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan
Abstract :
Conventional LED packaging structures do not take into account the output light properties very well. Based on microelectromechanical system (MEMS) technology, a method of microlens and LED integrated packaging is presented, which can enormously enhance output optical extraction efficiency, and improve the output optical performance. It is easy to realize mass production by the method
Keywords :
electronics packaging; light emitting diodes; microlenses; micromechanical devices; LED integrated packaging; microelectromechanical system technology; microlens design; microlens fabrication; optical extraction efficiency; Lenses; Light emitting diodes; Mass production; Micromechanical devices; Microoptics; Optical design; Optical device fabrication; Optical refraction; Packaging; Stimulated emission; Integrated packaging; LED; MEMS; Microlens;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359803
