Title :
Low-k and High Thermal Stable Fluorinated Epoxy Materials For Advanced Microelectronic Packaging Applications
Author :
Zhiqiang Tao ; Haixia ; Yang ; Lin Fan ; Shiyong Yang
Author_Institution :
Inst. of Chem., Chinese Acad. of Sci., Beijing
Abstract :
A novel fluorinated epoxy resin, 1,1-bis(4-glycidylesterphenyl)-1-(3-trifluoro-methylphenyl)-2,2,2-trifluo roetha ne (BGTF), was synthesized and cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4´-diaminodiphenyl-methane (DDM). As comparison, commercial available bisphenol-A type epoxy resin (BADGE) was cured by the same curing agent. It was showed that the cured epoxy resins showed good thermal stability and good mechanical properties. The cured epoxy resins also exhibited lower dielectric constants and water absorption than those of nonfluorinated epoxy. Clearly, the fluorinated epoxy resins have decreased the dielectric properties and water absorption due to the introduction of the CF3 groups in the epoxy resin backbone, compared with the nonfluorinated epoxy
Keywords :
carbon compounds; dielectric materials; electronics packaging; permittivity; polymers; thermal stability; 1,1-bis(4-glycidylesterphenyl)-1-(3-trifluoro-methylphenyl)-2,2,2- trifluoroetha ne; 4,4´-diaminodiphenyl-methane; CF3; bisphenol-A type epoxy resin; curing agent; dielectric constants; fluorinated epoxy materials; fluorinated epoxy resin; hexahydro-4-methylphthalic anhydride; microelectronic packaging; nonfluorinated epoxy; thermal stability; water absorption; Absorption; Curing; Dielectric constant; Distributed decision making; Epoxy resins; Mechanical factors; Microelectronics; Packaging; Thermal stability; Water; Dielectric properties; Fluorinated epoxy; Water absorption;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359806
