Low-k and High Thermal Stable Fluorinated Epoxy Materials For Advanced Microelectronic Packaging Applications

Author

Zhiqiang Tao ; Haixia ; Yang ; Lin Fan ; Shiyong Yang

Author_Institution

Inst. of Chem., Chinese Acad. of Sci., Beijing

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

5

Abstract

A novel fluorinated epoxy resin, 1,1-bis(4-glycidylesterphenyl)-1-(3-trifluoro-methylphenyl)-2,2,2-trifluo roetha ne (BGTF), was synthesized and cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4´-diaminodiphenyl-methane (DDM). As comparison, commercial available bisphenol-A type epoxy resin (BADGE) was cured by the same curing agent. It was showed that the cured epoxy resins showed good thermal stability and good mechanical properties. The cured epoxy resins also exhibited lower dielectric constants and water absorption than those of nonfluorinated epoxy. Clearly, the fluorinated epoxy resins have decreased the dielectric properties and water absorption due to the introduction of the CF₃ groups in the epoxy resin backbone, compared with the nonfluorinated epoxy

Keywords

carbon compounds; dielectric materials; electronics packaging; permittivity; polymers; thermal stability; 1,1-bis(4-glycidylesterphenyl)-1-(3-trifluoro-methylphenyl)-2,2,2- trifluoroetha ne; 4,4´-diaminodiphenyl-methane; CF₃; bisphenol-A type epoxy resin; curing agent; dielectric constants; fluorinated epoxy materials; fluorinated epoxy resin; hexahydro-4-methylphthalic anhydride; microelectronic packaging; nonfluorinated epoxy; thermal stability; water absorption; Absorption; Curing; Dielectric constant; Distributed decision making; Epoxy resins; Mechanical factors; Microelectronics; Packaging; Thermal stability; Water; Dielectric properties; Fluorinated epoxy; Water absorption;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359806

Filename

4198927