Low Cost Packages for MEMS Oscillators

This paper discusses the packaging strategies for low cost silicon MEMS resonators. The packaging requirements of silicon resonators are first discussed, and various wafer level vacuum packaging technologies suitable for silicon resonators are then listed. With proper selection of wafer level vacuum package, resonators can be treated as a piece of conventional silicon chip robust for assembly process. As a result, both low cost ceramic or plastic packages can be applied for silicon oscillators. At last reliability tests of both wafer level vacuum packaged resonators and silicon MEMS oscillators were conducted to verify the package design.