DocumentCode :
2576600
Title :
Flexible Design Techniques for Polysilicon MEMS Process
Author :
McNeil, Andrew
Author_Institution :
Freescale Inc., Tempe, AZ
fYear :
2007
fDate :
3-5 Oct. 2007
Firstpage :
290
Lastpage :
293
Abstract :
MEMS (micro electro mechanical systems) products have significant growth potential, and are being used in an increasing number of applications. One issue with MEMS devices is manufacture, as current MEMS manufacturing processes not standardized. Design techniques were developed to allow a single MEMS manufacturing flow to meet a wide range of accelerometer specifications. One technique is "Metal on proof mass", this is a design method that adds thermally dissimilar materials (such as metal) to the accelerometer proof mass, and isolates the proof mass from resulting thermal stresses. Another technique is "variable gap sense capacitance", which uses two different sensing gaps in capacitive transducers. This allows z-axis transducers to provide increased output and improved linearity.
Keywords :
micromechanical devices; MEMS device; MEMS manufacturing process; accelerometer proof mass; capacitive transducer; flexible design; microelectromechanical system; polysilicon MEMS process; thermal stress; variable gap sense capacitance; Accelerometers; Capacitance; Design methodology; Inorganic materials; Manufacturing processes; Mechanical systems; Microelectromechanical devices; Micromechanical devices; Thermal stresses; Transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
Conference_Location :
San Jose, CA
ISSN :
1089-8190
Print_ISBN :
978-1-4244-1335-5
Electronic_ISBN :
1089-8190
Type :
conf
DOI :
10.1109/IEMT.2007.4417079
Filename :
4417079
Link To Document :
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