DocumentCode
2576600
Title
Flexible Design Techniques for Polysilicon MEMS Process
Author
McNeil, Andrew
Author_Institution
Freescale Inc., Tempe, AZ
fYear
2007
fDate
3-5 Oct. 2007
Firstpage
290
Lastpage
293
Abstract
MEMS (micro electro mechanical systems) products have significant growth potential, and are being used in an increasing number of applications. One issue with MEMS devices is manufacture, as current MEMS manufacturing processes not standardized. Design techniques were developed to allow a single MEMS manufacturing flow to meet a wide range of accelerometer specifications. One technique is "Metal on proof mass", this is a design method that adds thermally dissimilar materials (such as metal) to the accelerometer proof mass, and isolates the proof mass from resulting thermal stresses. Another technique is "variable gap sense capacitance", which uses two different sensing gaps in capacitive transducers. This allows z-axis transducers to provide increased output and improved linearity.
Keywords
micromechanical devices; MEMS device; MEMS manufacturing process; accelerometer proof mass; capacitive transducer; flexible design; microelectromechanical system; polysilicon MEMS process; thermal stress; variable gap sense capacitance; Accelerometers; Capacitance; Design methodology; Inorganic materials; Manufacturing processes; Mechanical systems; Microelectromechanical devices; Micromechanical devices; Thermal stresses; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
Conference_Location
San Jose, CA
ISSN
1089-8190
Print_ISBN
978-1-4244-1335-5
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2007.4417079
Filename
4417079
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