• DocumentCode
    2576600
  • Title

    Flexible Design Techniques for Polysilicon MEMS Process

  • Author

    McNeil, Andrew

  • Author_Institution
    Freescale Inc., Tempe, AZ
  • fYear
    2007
  • fDate
    3-5 Oct. 2007
  • Firstpage
    290
  • Lastpage
    293
  • Abstract
    MEMS (micro electro mechanical systems) products have significant growth potential, and are being used in an increasing number of applications. One issue with MEMS devices is manufacture, as current MEMS manufacturing processes not standardized. Design techniques were developed to allow a single MEMS manufacturing flow to meet a wide range of accelerometer specifications. One technique is "Metal on proof mass", this is a design method that adds thermally dissimilar materials (such as metal) to the accelerometer proof mass, and isolates the proof mass from resulting thermal stresses. Another technique is "variable gap sense capacitance", which uses two different sensing gaps in capacitive transducers. This allows z-axis transducers to provide increased output and improved linearity.
  • Keywords
    micromechanical devices; MEMS device; MEMS manufacturing process; accelerometer proof mass; capacitive transducer; flexible design; microelectromechanical system; polysilicon MEMS process; thermal stress; variable gap sense capacitance; Accelerometers; Capacitance; Design methodology; Inorganic materials; Manufacturing processes; Mechanical systems; Microelectromechanical devices; Micromechanical devices; Thermal stresses; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
  • Conference_Location
    San Jose, CA
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-1335-5
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2007.4417079
  • Filename
    4417079