DocumentCode
2576635
Title
Scalable coarse WDM transceiver modules for satellite applications
Author
Guilfoyle, P. ; Harris, M. ; Retnasingham, U. ; Mahnkopf, S. ; Eustis, T. ; Kumar, D. ; Louderback, D.
Author_Institution
OptiComp Corp., Zephyr Cove, NV
fYear
2009
fDate
12-14 Jan. 2009
Firstpage
8
Lastpage
9
Abstract
Increasingly demanding requirements on the data communication networks in satellites is pushing the limits of electrical interconnect capabilities. Optical interconnects have been slow to be adopted in this application space due to the harsh environmental conditions and stringent qualification requirements that preclude the use of commercial optical transceivers. In particular, radiation, extreme temperature cycling, and high temperatures in vacuum are not compatible with many of the materials and packaging techniques used in commercial transceivers. The electronics in commercial optical transceivers are also prone to single event effects (SEE) from radiation exposure, including upset and latch-up. Commercial optical transceivers also lack sufficient self test and monitoring capabilities, as well as end-of-life (EOL) link power margin for satellite applications where replacing failed parts in not an option. In addition, satellite applications place a much higher value on reducing SWaP (especially power) and fiber count than commercial applications. OptiComp is developing coarse WDM optical transceivers specifically designed for satellite applications. The transceiver will be housed in a hermetically sealed ceramic column grid array (CGA) package to facilitate operation under vacuum conditions and over a large number of temperature cycles. The package interior features two shelves: one for an optoelectronic board hosting the optical transmitter and receiver subassemblies and one for an electronics board for a digital diagnostic monitoring interface (DDMI).
Keywords
optical communication; satellite communication; transceivers; wavelength division multiplexing; coarse WDM optical transceivers; data communication networks; digital diagnostic monitoring interface; hermetically sealed ceramic column grid array package; satellite applications; Artificial satellites; Data communication; Electronics packaging; Optical interconnections; Optical receivers; Optical transmitters; Qualifications; Temperature; Transceivers; Wavelength division multiplexing;
fLanguage
English
Publisher
ieee
Conference_Titel
IEEE/LEOS Winter Topicals Meeting Series, 2009
Conference_Location
Innsbruck
Print_ISBN
978-1-4244-2610-2
Electronic_ISBN
978-1-4244-2611-9
Type
conf
DOI
10.1109/LEOSWT.2009.4771629
Filename
4771629
Link To Document