Title :
Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System
Author :
Yong, Wayne ; Jin, Cai Xiao ; Ho, Hong Meng
Author_Institution :
Kulicke & Soffa Pte. Ltd., Singapore
Abstract :
A method has been proposed to model the illumination characteristics of a typical wire bonder vision system. The proposed model can be used to calibrate the illumination of the vision system to ensure the same level of illumination brightness across different machines, given the same lighting level setting. The approach to extract the machine illumination model is semi-empirical and the model provides a closed-form solution
Keywords :
lead bonding; lighting; pattern recognition; illumination calibration; illumination model; illumination system; lighting calibration; machine vision; pattern recognition system; vision system; wire bonding; Bonding; Brightness; Calibration; Charge-coupled image sensors; Light emitting diodes; Lighting; Machine vision; Modeling; Pattern recognition; Wire; illumination calibration; illumination model; lighting calibration; machine vision; vision system;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359814
