Title :
Solder Joint Thermal Fatigue Analysis of 48-FBGA
Author :
Chen, Song ; Lee, Taekoo ; Lee, Jaisun ; Feng, Nufeng
Author_Institution :
Samsung Semicond. (China) R&D Co.,Lt, Suzhou
Abstract :
A three-dimensional finite element model has been developed to study the solder joint reliability of 48-1/0 fine pitch ball-grid-array (FBGA) assembly. Anand model was selected to describe the 62Sn36Pb2Ag creep behavior. Sub-modeling technique was used to transfer the displacements to the local model for a detailed analysis under thermal cycling conditions. Solder ball visco-plastic energy accumulated per temperature cycle was applied in this BGA product to predict the fatigue life. In addition, the effect of PCB thickness was pointed briefly
Keywords :
ball grid arrays; fatigue cracks; integrated circuit reliability; lead alloys; silver alloys; solders; thermal stress cracking; tin alloys; viscoplasticity; ANSYS simuation; Anand model; FBGA; SnPbAg; fatigue life; fine pitch ball grid array; solder ball viscoplastic energy; solder joint reliability; thermal fatigue; three-dimentional finite element model; Assembly; Capacitive sensors; Creep; Electronics packaging; Equations; Fatigue; Finite element methods; Silicon; Soldering; Temperature; ANSYS; FBGA; simulation; solder joint; submodel; thermal fatigue; viscoplastic energy;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359816
