The Influence of the Chip-Scale-Package on the Functioning and Reliability of RF-MEMS Switches

Author

Song, Mingxin ; Zhu, Min ; He, Xunjun ; Yin, Jinghua

Author_Institution

Sch. of Appl. Sci., Harbin Univ. of Sci. & Technol.

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

4

Abstract

This paper discusses the influence of materials and structures inside a package on the functioning and reliability of chip-scale-package RF-MEMS switches. It is shown that materials and structures strongly influence electrical performance characteristics such as the switching insertion loss of switches. By computer simulation design for a RF MEMS switches and its package, a model is built with choiceness performance characteristics. Especially, the pull-up electrode can increase reliability of the device, which has extremely low insertion loss of -0.8 dB and a high isolation of -33 dB up to 20 GHz. The packaging process can be applied to process wafer of RF MEMS switching devices. This work will help designers of RF-MEMS switches remove redundant features optimize structures in MEMS component packages to get maximize performance and help drive cost down

Keywords

chip scale packaging; integrated circuit reliability; microswitches; radiofrequency integrated circuits; RF MEMS switches; chip scale package; computer simulation design; insertion loss; reliability; Chip scale packaging; Computer simulation; Design optimization; Electrodes; Insertion loss; Materials reliability; Performance loss; Radiofrequency microelectromechanical systems; Semiconductor device modeling; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359819

Filename

4198940