Title :
Application of Microwave Drilling to Electronic Ceramics Machining
Author :
Wang, Xuefang ; Liu, Weiqin ; Zhang, Honghai ; Liu, Sheng ; Gan, Zhiyin
Author_Institution :
Div. of MOEMS, Huazhong Univ. of Sci. & Technol., Wuhan
Abstract :
Ceramic materials are important in electronic industry. A number of ceramics are used in micro-electronic packaging and substrate manufacturing. However, hardness and brittleness of ceramics cause many difficulties in their machining. In this paper, a novel method is introduced for ceramic machining which uses the microwave energy. The method is based on the phenomenon of local hot spot produced by near-field microwave radiation. It is cheaper and more effective to the process of ceramics, and has advantages in improving process quality. The paper offers a model of microwave-drilling on a slice of ceramics and investigates the effect area of microwave. Parametric study is conducted and documented based on the proposed drilling model. In addition, a comparison is presented between the proposed microwave method and other methods, with the focus on the holes drilling of ceramics. Finally the paper discusses the prospect and issues of microwave-drilling in actual applications to micro-electronics industry
Keywords :
ceramics; drilling; electronics industry; electronic ceramics machining; micro electronics industry; microwave drilling; near field microwave radiation; Ceramics; Drilling; Electronics industry; Electronics packaging; Machining; Manufacturing; Microwave theory and techniques; Near-field radiation pattern; Packaging machines; Parametric study;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359824