• DocumentCode
    2576836
  • Title

    Application of Microwave Drilling to Electronic Ceramics Machining

  • Author

    Wang, Xuefang ; Liu, Weiqin ; Zhang, Honghai ; Liu, Sheng ; Gan, Zhiyin

  • Author_Institution
    Div. of MOEMS, Huazhong Univ. of Sci. & Technol., Wuhan
  • fYear
    2006
  • fDate
    26-29 Aug. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Ceramic materials are important in electronic industry. A number of ceramics are used in micro-electronic packaging and substrate manufacturing. However, hardness and brittleness of ceramics cause many difficulties in their machining. In this paper, a novel method is introduced for ceramic machining which uses the microwave energy. The method is based on the phenomenon of local hot spot produced by near-field microwave radiation. It is cheaper and more effective to the process of ceramics, and has advantages in improving process quality. The paper offers a model of microwave-drilling on a slice of ceramics and investigates the effect area of microwave. Parametric study is conducted and documented based on the proposed drilling model. In addition, a comparison is presented between the proposed microwave method and other methods, with the focus on the holes drilling of ceramics. Finally the paper discusses the prospect and issues of microwave-drilling in actual applications to micro-electronics industry
  • Keywords
    ceramics; drilling; electronics industry; electronic ceramics machining; micro electronics industry; microwave drilling; near field microwave radiation; Ceramics; Drilling; Electronics industry; Electronics packaging; Machining; Manufacturing; Microwave theory and techniques; Near-field radiation pattern; Packaging machines; Parametric study;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0619-6
  • Electronic_ISBN
    1-4244-0620-X
  • Type

    conf

  • DOI
    10.1109/ICEPT.2006.359824
  • Filename
    4198945