DocumentCode
2576847
Title
Technology roadmap and beyond
Author
Nishi, Y.
Author_Institution
Dept. of Electr. Eng., Stanford Univ., CA, USA
fYear
2003
fDate
29-31 Oct. 2003
Firstpage
2
Abstract
Summary form only given. This paper will cover the technology roadmap based trends of CMOS scaling in the past, today and tomorrow, and discus technical bottle neck and challenges mainly from device physics and technology point of view, followed by looking into several opportunities of nanoelectronic devices such as nanowires, nanotubes from device physics and integration point of view.
Keywords
CMOS integrated circuits; nanoelectronics; nanotube devices; nanowires; CMOS scaling; device integration; device physics; nanoelectronic devices; nanotubes; nanowires; technology roadmap; CMOS technology; Geometrical optics; Laser theory; Moore´s Law; Nanofabrication; Optical coupling; Product development; Rapid thermal processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-040-2
Type
conf
DOI
10.1109/IMNC.2003.1268489
Filename
1268489
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