Title :
Modeling and Parameter Extraction Methods of Bond-Wires for Chip-Package Co-Design
Author :
Jing, Weiping ; Sun, Ling ; Sun, Haiyan
Author_Institution :
Jiangsu Provincial Key Lab of ASIC Design, Nantong Univ.
Abstract :
The objective of this paper was to present a preparatory investigation of modeling of IC packages for chip-package co-design. Our work was focused on the modeling and parameter extraction methods of bond-wires. Based on two-port parameters, a lumped Pi-type equivalent circuit for a single-bond-wire was presented and the R, L, and C parameters of the bond-wire were extracted. In addition, multi-bond-wires were proposed for better performance by comparing their simulated S-parameters with measured results. Finally, a simple and low cost test structure was designed and made for validation of the parameterized model
Keywords :
S-parameters; equivalent circuits; integrated circuit packaging; lead bonding; lumped parameter networks; IC packages; S-parameters; bond-wires modeling; chip-package co-design; lumped Pi-type equivalent circuit; multibond-wires; parameter extraction; parameterized model; single-bond-wire; test structure; two-port parameters; Bonding; Costs; Dielectric losses; Equivalent circuits; Frequency; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Parameter extraction; Scattering parameters;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359827
