The Application of Nanocone Array in Pd Pre-Plated Frame

Since Pd pre-plated frame (Pd PPF) use Au as the end finish, the weak adhesion between the surface noble metal Au and the epoxy molding compound (EMC) often aggravates the delamination and affects the reliability of IC package. The shortage limits the application of Pd PPF in the fields that require high reliability. In this paper, the application of the nanocone array technology based on the special electrodeposition method to improve the adhesion between Pd PPF leadframe and EMC was reported. The surface area of nanocone array Pd PPF was much larger than that of the normal Pd PPF. The adhesion between the EMC and nanocone Pd PPF was 3 ~ 4 times higher than that of the normal Pd PPF, while maintained the other properties of the normal Pd PPF