Title :
The Effects of Packaging on RFICs
Author :
Mandal, Gunjan ; Mishra, Gaurav ; van Driel, W.D. ; Zhang, G.Q.
Author_Institution :
Dept. of Electr. Eng. & Mech. Comput. Sci., Delft Univ. of Technol.
Abstract :
Rapid growth of wireless market and competitive pressure has pushed the electrical performance of radio frequency integrated circuits (RFICs) to next level. The performance of RFICs at microwave frequencies depends very much on the package parasitic. Hence, the choice of proper packages depending on application of RFICs is of utmost importance. This paper describes our investigation of the effects of packaging (technology and material) on the performance of RFICs for different application areas
Keywords :
integrated circuit packaging; radiofrequency integrated circuits; RFIC; electrical performance; package parasitics; packaging effect; packaging material; packaging technology; radio frequency integrated circuits; Chip scale packaging; Costs; Electronics packaging; Integrated circuit packaging; Integrated circuit technology; Microwave frequencies; Packaging machines; Plastics; Radiofrequency integrated circuits; Semiconductor device packaging;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359832
