Challenges and Opportunities in System-in-Package (SiP) Business

System-in-package (SiP) is generally regarded as the long-awaited renaissance of multichip module (MCM) since it´s firstly introduced and assembled in a decade ago. As a matter of fact, simultaneously satisfaction of a number of key determining factors as well as the timely emergences of certain critical technologies are the reasons for the expeditious development of SiP in recent years, including the advancements in assembly technology, novel development of low-cost, high performance substrate materials, and more importantly, massive demands on high-performance and compact product profiles. Recent report has outlined the major reasons for industry to adopt SiP in their products, comprising miniaturization (3 7 %), electromagnetic insulation (EMI) noise reduction (26%), lower power consumption (13%), total cost reduction (12%) and circuitry simplification in high speed applications (12%). Nevertheless, there are still certain key issues necessary to be overcome for the robust development of SiP technology, for example, the availability of bare die and known good die (KGD), overall assembly yield, overall signal integrity of the system module particularly in high-speed/high frequency applications, heat dissipation in densely packed modules, lifetime prediction, etc. The outsourcing customs of the industry to date have also presented considerable challenges to the prevalence of SiP. Moreover, intimate collaborations among various sectors along the materials supply chain, semiconductor and assembly and testing (SAT) subcontractors are definitely the turnkey solution to timely deliver prototype products prior to mass production. Providing robust substrate design to insure first-pass success with the right design technologies is also challenging in order to satisfy the demands on low-cost, optimal performance and outstanding reliability. In this study we first try to elucidate the factors determining the successfulness of SiP, from the perspective of volume-in-productio- - n, technology advancement favoring SiP development and demands from various applications. Afterwards, we illustrate the challenges that the industries along the entire electronic packaging supply chain are facing in SiP implementation. We put forward to address the critical demands on having a design centre with integrated capabilities and experiences on packaging design, substrate layout, EM and thermal-mechanical analyses, package characterizations and prototyping and coordinations among various companies in order to assist the customers in developing advanced IC/module packaging solutions for mass production of their new products in a timely manner