• DocumentCode
    2577080
  • Title

    Material and fabrication challenges in the development of monolithic solid oxide fuel cells

  • Author

    Balachandran, U. ; Dorris, S.E. ; Picciolo, J.J. ; Poeppel, R.B. ; McPheeters, C.C. ; Minh, N.Q.

  • Author_Institution
    Argonne Nat. Lab., IL, USA
  • fYear
    1989
  • fDate
    6-11 Aug 1989
  • Firstpage
    1541
  • Abstract
    The authors discuss material properties, material requirements, and fabrication issues in the development of the monolithic solid oxide fuel cell (MSOFC). The MSOFC is composed of a honeycomb of very small cells, each 1 to 2 mm in diameter. The walls of the honeycomb are formed from thin (25 to 100 μm) ceramic layers of four cell components. The MSOFC imposes stringent requirements for stability, conductivity, compatibility, and thermal properties of the constituent materials at the operating temperature of about 1000°C. Successful fabrication of an MSOFC depends on incorporating the materials into a self-supporting structure at a higher sintering temperature. A fabrication scheme for the MSOFC must incorporate each material in such a way that conditions at each fabrication step will not destroy desired material characteristics of any of the component layers. Materials development for the cathode, anode, electrolyte, and interconnect is discussed, and the tape casting and tape calendering fabrication processes are examined
  • Keywords
    fuel cells; 1000 degC; anode; cathode; ceramic layers; compatibility; conductivity; electrolyte; fabrication; interconnect; monolithic solid oxide fuel cells; sintering temperature; stability; tape calendering fabrication processes; tape casting; thermal properties; Cathodes; Ceramics; Conducting materials; Fabrication; Fuel cells; Material properties; Solids; Temperature dependence; Thermal conductivity; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Engineering Conference, 1989. IECEC-89., Proceedings of the 24th Intersociety
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/IECEC.1989.74674
  • Filename
    74674