• DocumentCode
    2577151
  • Title

    Study on Interconnect Test Generation ofMCM based on Particle Swarm Optimization Algorithm

  • Author

    Chen, Lei

  • Author_Institution
    Dept. of Comput. Sci., Guilin Univ. of Electron. Technol.
  • fYear
    2006
  • fDate
    26-29 Aug. 2006
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    With rapid development of very large scale integration (VLSI), multichip module (MCM) and multilayer printed circuit boards (MPCB), interconnect test technology has become a bottleneck in the application of these circuits. This paper presents a novel optimized approach based on particle swarm optimization (PSO) algorithm for MCM interconnect test generation. By combing the characteristics of interconnect test and constructing particle expression of test generation, the velocity updating equation and position updating equation of discrete PSO is designed for MCM in this paper. The optimized search is guided by the swarm intelligent generated from cooperation and competition among particles of swarm. The experimental results for benchmark circuits show that the proposed algorithm can achieve compact test set, high fault coverage and short CPU time when compared to other interconnect test generation algorithms
  • Keywords
    VLSI; automatic test pattern generation; multichip modules; particle swarm optimisation; printed circuits; MCM; MPCB; VLSI; interconnect test generation; multichip module; multilayer printed circuit boards; particle swarm optimization algorithm; very large scale integration; Benchmark testing; Character generation; Circuit testing; Equations; Integrated circuit interconnections; Multichip modules; Nonhomogeneous media; Particle swarm optimization; Printed circuits; Very large scale integration; MCM (Multi-chip Module); Particle swarm optimization; interconnect test; test generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0619-6
  • Electronic_ISBN
    1-4244-0620-X
  • Type

    conf

  • DOI
    10.1109/ICEPT.2006.359844
  • Filename
    4198965