Title :
Metal filling in deep nano trenches/holes using supercritical carbon dioxide
Author_Institution :
Interdisciplinary Graduate Sch. of Med. & Eng., Yamanashi Univ., Kofu, Japan
Abstract :
This paper reports the deep Cu filling process. Deposition of Ru is also presented. The Cu filling capability was found to greatly depend on the precursor. When Cu/sup II/(dibm)/sub 2/ was used instead of Cu/sup II/(hfac)/sub 2/, a significant improvement in the deep via filling capability under the same deposition conditions was observed.
Keywords :
chemical vapour deposition; copper; filling; metallisation; ruthenium; Cu; Ru; Ru deposition; chemical vapour deposition; deep Cu filling; metal filling; metallisation; nano trenches/holes; Biomedical imaging; Carbon dioxide; Ferroelectric materials; Filling; Metallization; Plasma temperature; Surface tension; Temperature distribution; Tin; Ultra large scale integration;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-040-2
DOI :
10.1109/IMNC.2003.1268509
