Title :
MEMS fabrication of high aspect ratio track-following microactuator for hard disk drive using silicon on insulator
Author :
Bong-Hwan Kim ; Sangjun Park ; Hyeon-Cheol Kim ; Kukjin Chun ; Dong-II Dan Cho ; Jong-Won Lee ; Hyo-Jung Lee ; Seung-Han Kim ; Woo-Kyeong Seong ; Young-Jae An
Author_Institution :
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Abstract :
We have achieved a high aspect ratio track-following microactuator (TFMA) which is capable of driving 2 /spl mu/g magnetic head for hard disk drive (HDD). It was fabricated on silicon on insulator (SOI) wafer with 20 /spl mu/m thick active silicon and 2 /spl mu/m thick thermally grown oxide and piggyback electrostatic principle was used for driving TFMA. The first vibration mode frequency of TFMA was 18.5 kHz which is enough for a recording density of higher than 10 Gb/in/sup 2/. Its displacement was 1.4 /spl mu/m when 15 V DC bias plus 15 V AC sinusoidal driving input was applied and its electrostatic force was 50 /spl mu/N when input voltage was 30 V.
Keywords :
disc drives; electrostatic actuators; etching; hard discs; micromachining; silicon-on-insulator; 15 V; 18.5 kHz; 2 micron; 20 micron; 30 V; MEMS fabrication; Si; Si-SiO/sub 2/; comb drive actuator; electrostatic force; fast tracking; first vibration mode frequency; hard disk drive; high aspect ratio; magnetic head drive; piggyback electrostatic principle; process flow; sequential etching; servo control; silicon on insulator; sinusoidal driving input; thermally grown oxide; track-following microactuator; Disk recording; Electrostatics; Fabrication; Frequency; Hard disks; Insulation life; Magnetic heads; Microactuators; Micromechanical devices; Silicon on insulator technology;
Conference_Titel :
Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-5194-0
DOI :
10.1109/MEMSYS.1999.746751
