FEA Simulation and In-situ Warpage Monitoring of Laminated Package Molded with Green EMC Using Shadow Morie System

The warpage of individual IC panel/package or whole molded strips keeps changing with temperature during the assembly processes from die bonding, wire bonding, molding, post-mold cure to soldering reflow. How to optimize package design and properties of all assembly materials to obtain acceptable warpage level both at room temperature and reflow temperature becomes more challenging. In this study, finite element analysis (FEA) simulation was performed in warpage prediction of three types of advanced laminated IC packages (PBGA, CSP BGA and PoP BGA). Shadow Morie system was used in monitoring warpage deviation under temperature profile from -55degC to 260degC. Calibration or correction of FEA results can be performed by introducing experimental results from Shadow Morie measurement to fine-tune the modeling so as to obtain more accurate prediction