DocumentCode :
2577470
Title :
Design of Lead-Frame Driving Mechanical Structure of Die Bonder
Author :
Li, Ketian ; Chen, Xin ; Wu, Xiaohong ; Wang, Xiaochu ; Gao, Jian
Author_Institution :
Sch. of Mech. & Electr. Eng., Guangdong Univ. of Technol., Guangzhou
fYear :
2006
fDate :
26-29 Aug. 2006
Firstpage :
1
Lastpage :
3
Abstract :
It was discussed the lead-frame driving structure moving along straight rail intermittently, especially the 3D cam in the designed die bonder. The driving part was controlled to fulfil scheduled moving rule by the curve of the 3D contour in the XY plane and Z directions. The contact structure was designed as two side slopes where contacted with the moving part of the 3D cam, by which the branched wrist rack could be forced by the two slopes and Z direction. In addition, the branched wrist could rotate around its geometry center axle, adjusting the contact state between the rollers and the cam surface automatically, to suit the turning movement of the slope contour of the 3D cam. The conveyor system could make the indexer insert the lead-frame, move forward, locate laterally, move back slight, exit from the lead-frame, and return to the start point in a circulation manner
Keywords :
drives; integrated circuit manufacture; microassembling; servomotors; branched wrist; contact structure; die bonder; lead-frame driving mechanical structure; Axles; Bonding; Circuit testing; Friction; Geometry; Motion control; Servomechanisms; Servomotors; Space technology; Wrist;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
Type :
conf
DOI :
10.1109/ICEPT.2006.359860
Filename :
4198981
Link To Document :
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