• DocumentCode
    2577534
  • Title

    A MCM Interconnect Test Generation Approach Using Ant Colony Algorithm with Crossover and Mutation Operator

  • Author

    Chen, Lei

  • Author_Institution
    Dept. of Comput. Sci., Guilin Univ. of Electron. Technol.
  • fYear
    2006
  • fDate
    26-29 Aug. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Interconnect test technology has become a bottleneck in the application of MCM. In this paper, a new multichip module (MCM) interconnect test generation approach based on ant colony algorithm (ACA) with crossover and mutation operator is presented. By combing the characteristics of MCM interconnect test, the pheromone updating rule and state transition rule of ant colony algorithm is designed. Using crossover and mutation operator, this approach overcomes ordinary ant colony algorithm´s defects of slow convergence speed, easy to get stagnate, and low ability of full search. The international standard MCM benchmark circuit provided by the MCNC group was used to verify the approach. The results of simulation experiments, which compare to the results of standard ant colony algorithm, genetic algorithm (GA) and other deterministic interconnecting test generation algorithms, show that the proposed approach can achieve higher fault coverage and more compact test sets
  • Keywords
    artificial life; integrated circuit testing; multichip modules; MCM interconnect test generation approach; ant colony algorithm; crossover; genetic algorithm; multichip module interconnect test generation; mutation operator; Algorithm design and analysis; Benchmark testing; Circuit faults; Circuit simulation; Circuit testing; Convergence; Genetic algorithms; Genetic mutations; Integrated circuit interconnections; Multichip modules; MCM (Multi-chip Module); ant colony algorithm; interconnect test; test generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0619-6
  • Electronic_ISBN
    1-4244-0620-X
  • Type

    conf

  • DOI
    10.1109/ICEPT.2006.359864
  • Filename
    4198985