Investigation of Creep Behavior of a Lead-Free Solder Alloy Sn96.5Ag3.5

Author

Zhu, Fulong ; Zhang, Honghai ; Guan, Rongfeng ; Liu, Sheng

Author_Institution

Inst. of Microsyst., Huazhong Univ. of Sci. & Technol., Wuhan

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

4

Abstract

The creep properties of the lead-free solder alloy Sn96.5Ag3.5 were investigated and compared with those of the typical Pb-containing solder Sn63Pb37. Creep tests of this lead-free solder Sn96.5Ag3.5 and Pb-containing solder Sn63Pb37 at two temperatures of 25 degC and 125 degC were conducted at different constant stress levels and a series of consistent and reliable creep data were obtained. It was found that environmental temperature is critical to the creep property of two solder alloys Sn96.5Ag3.5 and Sn63Pb37. The lead-free solder alloy Sn96.5Ag3.5 showed good creep resistance and deformation resistance; the creep behavior of this lead-free solder Sn96.5Ag3.5 reveals the temperature sensitivity. This lead-free solder alloy Sn96.5Ag3.5 may substitute the typical Pb-containing solder alloys as the interconnecting and packaging materials in some microelectronic component encapsulation and assembly

Keywords

creep testing; silver alloys; solders; tin alloys; 125 C; 25 C; SnAg; creep behavior; creep resistance; creep tests; deformation resistance; lead-free solder alloy; packaging materials; temperature sensitivity; Assembly; Creep; Encapsulation; Environmentally friendly manufacturing techniques; Lead; Microelectronics; Packaging; Stress; Temperature sensors; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359866

Filename

4198987