Title :
Investigation of Creep Behavior of a Lead-Free Solder Alloy Sn96.5Ag3.5
Author :
Zhu, Fulong ; Zhang, Honghai ; Guan, Rongfeng ; Liu, Sheng
Author_Institution :
Inst. of Microsyst., Huazhong Univ. of Sci. & Technol., Wuhan
Abstract :
The creep properties of the lead-free solder alloy Sn96.5Ag3.5 were investigated and compared with those of the typical Pb-containing solder Sn63Pb37. Creep tests of this lead-free solder Sn96.5Ag3.5 and Pb-containing solder Sn63Pb37 at two temperatures of 25 degC and 125 degC were conducted at different constant stress levels and a series of consistent and reliable creep data were obtained. It was found that environmental temperature is critical to the creep property of two solder alloys Sn96.5Ag3.5 and Sn63Pb37. The lead-free solder alloy Sn96.5Ag3.5 showed good creep resistance and deformation resistance; the creep behavior of this lead-free solder Sn96.5Ag3.5 reveals the temperature sensitivity. This lead-free solder alloy Sn96.5Ag3.5 may substitute the typical Pb-containing solder alloys as the interconnecting and packaging materials in some microelectronic component encapsulation and assembly
Keywords :
creep testing; silver alloys; solders; tin alloys; 125 C; 25 C; SnAg; creep behavior; creep resistance; creep tests; deformation resistance; lead-free solder alloy; packaging materials; temperature sensitivity; Assembly; Creep; Encapsulation; Environmentally friendly manufacturing techniques; Lead; Microelectronics; Packaging; Stress; Temperature sensors; Testing;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359866
