DocumentCode :
2577642
Title :
Micro heat exchanger by using MEMS impinging jets
Author :
Wu, S. ; Mai, J. ; Tai, Y.C. ; Ho, C.M.
Author_Institution :
Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
fYear :
1999
fDate :
21-21 Jan. 1999
Firstpage :
171
Lastpage :
176
Abstract :
A micro impinging-jet heat exchanger is presented. Heat transfer is studied for single jet, slot arrays and jet arrays. In order to facilitate micro heat transfer measurements with these devices, a MEMS sensor chip, which has an 8/spl times/8 temperature-sensor array on one side, and an integrated heater on the other side has been designed and fabricated. This sensor chip allows 2-D surface temperature measurement with various jets impinging on it. It is found that micro impinging jets can be highly efficient when compared to existing macro impinging-jet microelectronics packages such as IBM 4381. For example, using a single nozzle jet (500-/spl mu/m diameter driven by 5 psig pressure), the sensor chip (2/spl times/2 cm/sup 2/) temperature can be cooled down from 70 to 33/spl deg/C. The cooling becomes more efficient when nozzle arrays (4/spl times/5 over 1 cm/sup 2/ area) are used under the same driving pressure. Interestingly, although higher driving pressure gives better cooling (lower surface temperature), the cooling efficiency, defined as h/0.5 /spl rho//spl nu//sup 2/, is actually higher for lower driving pressure.
Keywords :
arrays; cooling; heat exchangers; heat sinks; jets; microfluidics; microsensors; nozzles; temperature distribution; temperature sensors; thermal management (packaging); 2D surface temperature measurement; 500 micron; 70 to 33 C; MEMS impinging jets; MEMS sensor chip; Parylene layer; Si; chip cooling; cooling efficiency; driving pressure; heat transfer; integrated heater; jet arrays; micro heat exchanger; micro-cooling; microelectronics packages; nozzle arrays; nozzle diameter; nozzle spacing; polysilicon heater; single jet; slot arrays; temperature distribution; temperature-sensor array; Cooling; Heat transfer; Microelectronics; Micromechanical devices; Packaging; Semiconductor device measurement; Sensor arrays; Temperature measurement; Temperature sensors; Thermal sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
Conference_Location :
Orlando, FL, USA
ISSN :
1084-6999
Print_ISBN :
0-7803-5194-0
Type :
conf
DOI :
10.1109/MEMSYS.1999.746799
Filename :
746799
Link To Document :
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