DocumentCode :
2577678
Title :
Cu/M/Cu Sub-mount Applied in High Brightness LED Array Package
Author :
Liu, Sheng ; Song, Jingming
Author_Institution :
Inst. of Microsyst., HuaZhong Univ. of Sci. & Technol., Wuhan
fYear :
2006
fDate :
26-29 Aug. 2006
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, we demonstrate a packaging method for component of light emitting diode (LED) by silicon bulk micromachining technologies and using a silicon substrate with Cu/M/Cu foil to dissipate heat and match thermal expansion coefficient (CTE). The objective is to develop an LED package that can overcome high brightness LED life, high operating current and the ability to drive the devices at higher power and higher brightness. In our experiment, the optical and thermal characterization of the novel package structure was measured. Research results have shown that the sub-mount with Cu/M/Cu foil can enhance heat removal for safe junction temperature operation and minimize thermal stress caused by mismatch of CTE. Moreover, this kind of packaging can be used for packaging MEMS and conventional optoelectric semiconductor devices
Keywords :
copper alloys; light emitting diodes; magnesium alloys; micromachining; silicon; thermal expansion; thermal management (packaging); thermal stresses; Cu-Mg-Cu; Cu/M/Cu foil; LED array packaging method; light emitting diodes; optical characterization; silicon bulk micromachining technologies; thermal characterization; thermal expansion coefficient; thermal stresses; Brightness; Light emitting diodes; Micromachining; Micromechanical devices; Semiconductor device packaging; Silicon; Substrates; Temperature; Thermal expansion; Thermal stresses; Dissipater; LED; Package;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
Type :
conf
DOI :
10.1109/ICEPT.2006.359872
Filename :
4198993
Link To Document :
بازگشت