DocumentCode :
2577689
Title :
A Closed Micro Jet Cooling System for High Power LEDs
Author :
Luo, Xiaobing ; Liu, Sheng
Author_Institution :
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan
fYear :
2006
fDate :
26-29 Aug. 2006
Firstpage :
1
Lastpage :
7
Abstract :
In this paper, a micro jet based cooling system for the thermal management of high power LEDs is briefly introduced. Our experiments have demonstrated that the optimization on micro jet device is strongly needed for improving the system performance. To realize the above attempt, numerical optimization on micro jet device is conducted in details in this paper. The comparison between simulation and experiment results is presented and the results demonstrate that the present simulation model can work well. By using the above model, the effects of micro jet diameter, top cavity height, micro pump flow rate and jet device material on system performance are numerically studied. The simulation results show that top cavity height does not have very significant effect on improving cooling performance, however, increasing top cavity markedly result in the increase of flow resistance. The micro jet diameter has strong effect on cooling performance of the present micro jet device, as to present design, an optimized diameter exists for achieving best cooling performance. Increasing pump flow rate makes a sharp increase of the flow resistance. The material of device shell with high thermal conductivity can ameliorate the cooling performance, but the function is limited. According to our preliminary tests and numerical optimization, an optimized micro jet cooling system is fabricated and applied in thermal management of a 220W LED lamp. The temperature test demonstrates the cooling system works well
Keywords :
cooling; light emitting diodes; optimisation; thermal conductivity; thermal management (packaging); 220 W; LED lamp; flow resistance; high power LED; jet device material; microjet cooling system; microjet device; microjet diameter; micropump flow rate; numerical optimization; thermal conductivity; thermal management; top cavity height; Conducting materials; Cooling; Energy management; Light emitting diodes; Micropumps; Power system management; System performance; System testing; Thermal conductivity; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
Type :
conf
DOI :
10.1109/ICEPT.2006.359873
Filename :
4198994
Link To Document :
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