• DocumentCode
    2577721
  • Title

    A new class of surface modifiers for stiction reduction

  • Author

    Bong-Hwan Kim ; Chang-Hoon Oh ; Kukjin Chun ; Taek-Dong Chung ; Jang-Woong Byun ; Yoon-Sik Lee

  • Author_Institution
    Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
  • fYear
    1999
  • fDate
    21-21 Jan. 1999
  • Firstpage
    189
  • Lastpage
    193
  • Abstract
    In order to achieve stiction-free polysilicon surfaces, we have suggested a new class of chemical grafting precursors and confirmed their excellent characteristics. The strategy is to adopt dialkyldichlorosilanes (DDS, R/sub 2/SiCl/sub 2/) instead of monoalkyltrichlorosilanes (MTS, RSiCl/sub 3/) such as octadecyltrichlorosilane (OTS, C/sub 18/H/sub 37/SiCl/sub 3/) or 1 H,1 H,2 H,-2 H-perfluorodecyltrichlorosilane (FDTS, C/sub 10/H/sub 4/F/sub 17/SiCl/sub 3/). DDS has two short chains and compactly deposits on the hydrophilic polysilicon surface. DDS coated surface is even superior to those of conventional compounds in some respects. Since interactions among precursor molecules are reduced, conglomeration both in homogeneous solution and on surface can be effectively avoided. No difference was found between results from the processes in ambient environment and in dry box. And the final quality of the modified surfaces is much less dependent on temperature. In addition, DDS has some advantages of remarkably reduced process time and acceptably low cost. Even the cantilevers with 3 mm in length can be protected successfully from the stiction.
  • Keywords
    elemental semiconductors; micromachining; silicon; stiction; surface treatment; DDS coating; Si; chemical grafting precursor; dialkyldichlorosilane; hydrophilicity; micromachining technology; microstructure fabrication; polysilicon cantilever beam; stiction; surface modifier; Biomedical engineering; Chemical engineering; Chemical technology; Coatings; Engineering in medicine and biology; Humidity; Microstructure; Plasma temperature; Surface topography; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5194-0
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1999.746804
  • Filename
    746804