DocumentCode
2577861
Title
Optimization of Screen Printing Process
Author
Cao, Kun ; Cheng, Kai ; Wang, Ziliang
Author_Institution
Nanjing Electron. Device Inst.
fYear
2006
fDate
26-29 Aug. 2006
Firstpage
1
Lastpage
4
Abstract
The demands of modern micro-electronics packaging industry to printing quality and printing pattern resolution are higher and higher. Printing lines and the resolution relates to many factors, such as the silk screen, the thickness of emulsion and the choice of process parameters. In this article, how to improve the printing quality is discussed in the aspects above, especially how to obtain high-resolution printing lines
Keywords
integrated circuit packaging; thick films; emulsion thickness; printing pattern resolution; screen printing; Conducting materials; Electronics industry; Electronics packaging; Industrial electronics; Integrated circuit technology; Printed circuits; Printing; Production; Space technology; Wire; Resolution; Screen printing; Snap-off; Thickness of emulsion; Velocity of squeegee;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0619-6
Electronic_ISBN
1-4244-0620-X
Type
conf
DOI
10.1109/ICEPT.2006.359881
Filename
4199002
Link To Document