Title :
Optimization of Screen Printing Process
Author :
Cao, Kun ; Cheng, Kai ; Wang, Ziliang
Author_Institution :
Nanjing Electron. Device Inst.
Abstract :
The demands of modern micro-electronics packaging industry to printing quality and printing pattern resolution are higher and higher. Printing lines and the resolution relates to many factors, such as the silk screen, the thickness of emulsion and the choice of process parameters. In this article, how to improve the printing quality is discussed in the aspects above, especially how to obtain high-resolution printing lines
Keywords :
integrated circuit packaging; thick films; emulsion thickness; printing pattern resolution; screen printing; Conducting materials; Electronics industry; Electronics packaging; Industrial electronics; Integrated circuit technology; Printed circuits; Printing; Production; Space technology; Wire; Resolution; Screen printing; Snap-off; Thickness of emulsion; Velocity of squeegee;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359881
