DocumentCode :
2577878
Title :
The art of optoelectronic packaging
Author :
Pietralunga, Silvia M. ; Pianciola, Aurelio ; Romagnoli, Marco ; Martinelli, Mario
Author_Institution :
CoreCom, Milan
Volume :
4
fYear :
2008
fDate :
22-26 June 2008
Firstpage :
120
Lastpage :
122
Abstract :
Optoelectronic packaging is the art of turning well-performing demonstrators of working principles into real devices, so as to guarantee required performances, reliability and cost-effectiveness. To this complex aim, packaging leads many heterogeneous disciplines to convergence, spanning from optics to mechanics, to electronics and material science. Optoelectronic packaging issues and solutions strongly differ, depending on the nature of the system to be implemented and on its level of integration. Three different cases of optical systems for telecomm applications will be discussed, respectively representing on-package integration, on-board hybrid integration and on-chip integration of a monolithic silicon-optics subsystem.
Keywords :
electronics packaging; optoelectronic devices; monolithic silicon-optics subsystem; on-board hybrid integration; on-chip integration; on-package integration; optical systems; optoelectronic packaging; telecomm applications; Art; Consumer electronics; Electronic packaging thermal management; Electronics packaging; High speed optical techniques; Integrated optics; Materials science and technology; Optical design; Optical filters; Technological innovation; hybrid integration; on-package integration; optoelectronic packaging; photonic integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Transparent Optical Networks, 2008. ICTON 2008. 10th Anniversary International Conference on
Conference_Location :
Athens
Print_ISBN :
978-1-4244-2625-6
Electronic_ISBN :
978-1-4244-2626-3
Type :
conf
DOI :
10.1109/ICTON.2008.4598749
Filename :
4598749
Link To Document :
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