• DocumentCode
    2577889
  • Title

    A novel micro electro-discharge machining method using electrodes fabricated by the LIGA process

  • Author

    Takahata, K. ; Shibaike, N. ; Guckel, H.

  • Author_Institution
    Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
  • fYear
    1999
  • fDate
    21-21 Jan. 1999
  • Firstpage
    238
  • Lastpage
    243
  • Abstract
    This paper describes a new micromachining method which can produce ultrafine patterned high-aspect-ratio micro components from various kinds of materials that include those which cannot be used by silicon or the LIGA processes. This method, based on micro electro-discharge machining employs patterned high-aspect-ratio machining electrodes fabricated by the LIGA process. With this method patterned structures of several metals such as stainless steel and tungsten carbide super hard alloy have been successfully machined with short machining times. In this machining, copper electrodes electroplated via the LIGA process show good performance as far as wear resistance in the fine discharge energy region is concerned. Multiple structures have been also produced in parallel by using an electrode array. These results show that this method can be used to produce high-aspect-ratio micro components. It also shows that structures from materials which cannot be used by other micromachining techniques have become possible.
  • Keywords
    LIGA; cermets; copper; electrical discharge machining; electroplating; microelectrodes; micromachining; stainless steel; wear resistance; Cu; LIGA fabricated electrodes; SEM image; WC; WC-Co; electroplated copper electrodes; high-aspect-ratio micro components; micro dies; micro electro-discharge machining method; micromachining method; multiple structures; nozzles; parallel machining; stainless steel; tungsten carbide super hard alloy; ultrafine patterned; wear resistance; Computer industry; Conducting materials; Copper; Electrodes; Machining; Micromachining; Nickel; Shape; Textile industry; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5194-0
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1999.746822
  • Filename
    746822