DocumentCode
2577889
Title
A novel micro electro-discharge machining method using electrodes fabricated by the LIGA process
Author
Takahata, K. ; Shibaike, N. ; Guckel, H.
Author_Institution
Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
fYear
1999
fDate
21-21 Jan. 1999
Firstpage
238
Lastpage
243
Abstract
This paper describes a new micromachining method which can produce ultrafine patterned high-aspect-ratio micro components from various kinds of materials that include those which cannot be used by silicon or the LIGA processes. This method, based on micro electro-discharge machining employs patterned high-aspect-ratio machining electrodes fabricated by the LIGA process. With this method patterned structures of several metals such as stainless steel and tungsten carbide super hard alloy have been successfully machined with short machining times. In this machining, copper electrodes electroplated via the LIGA process show good performance as far as wear resistance in the fine discharge energy region is concerned. Multiple structures have been also produced in parallel by using an electrode array. These results show that this method can be used to produce high-aspect-ratio micro components. It also shows that structures from materials which cannot be used by other micromachining techniques have become possible.
Keywords
LIGA; cermets; copper; electrical discharge machining; electroplating; microelectrodes; micromachining; stainless steel; wear resistance; Cu; LIGA fabricated electrodes; SEM image; WC; WC-Co; electroplated copper electrodes; high-aspect-ratio micro components; micro dies; micro electro-discharge machining method; micromachining method; multiple structures; nozzles; parallel machining; stainless steel; tungsten carbide super hard alloy; ultrafine patterned; wear resistance; Computer industry; Conducting materials; Copper; Electrodes; Machining; Micromachining; Nickel; Shape; Textile industry; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
Conference_Location
Orlando, FL, USA
ISSN
1084-6999
Print_ISBN
0-7803-5194-0
Type
conf
DOI
10.1109/MEMSYS.1999.746822
Filename
746822
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