Title :
Experimental Determination of Mechanical Properties for Lead-Free Material SnAgCu
Author :
Qiang, Wang ; Lihua, Liang ; Yong, Liu
Author_Institution :
MOE Key Lab. of Mech. Manuf. & Autom., Zhejiang Univ. of Technol., Hangzhou
Abstract :
A series of tensile tests of 95.5Sn4.0Ag0.5Cu under a wide range of temperatures and constant strain rates are conducted. Base on the test results, empirical equations for predicting tensile strength, elastic modulus and yield stress are fitted as the functions of temperature. From the data of tests, it is found that temperature and strain rate demonstrate crucial effects on tensile and creep properties of SnAgCu material. The tests have disclosed certain viscoplastic behavior, temperature dependence, strain rate sensitivity and creep resistance. Finally, the mechanical properties such as tensile strength, yield stress and viscoplastic behavior are studied
Keywords :
copper alloys; creep; elastic moduli; silver alloys; tensile strength; tensile testing; tin alloys; viscoplasticity; yield stress; SnAgCu; creep properties; elastic modulus; lead-free material; mechanical properties; tensile strength; tensile tests; viscoplasticity; yield stress; Conducting materials; Creep; Environmentally friendly manufacturing techniques; Equations; Mechanical factors; Temperature distribution; Temperature sensors; Tensile strain; Tensile stress; Testing; Lead-free material; Viscoplasticity; tensile tests;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359649
