DocumentCode :
2577945
Title :
Reliability Study in Solder Joint under Electromigration and Thermal-Mechanical Load
Author :
Lihua, Liang ; Yong, Liu
Author_Institution :
Fairchild-ZJUT Microelectron. Packaging Joint Lab, Zhejiang Univ. of Technol., Hangzhou
fYear :
2006
fDate :
26-29 Aug. 2006
Firstpage :
1
Lastpage :
5
Abstract :
This paper presents a numerical study of electronic migration in solder joint under the interaction of high current density, thermal load and mechanical load. Three dimensional finite element model of a flip chip solder joint structure is developed and tested through numerical experiment. An improved algorithm of void formation and propagation in solder joints has been developed with consideration of electro-migration, thermo-migration and stress-migration. The improved algorithm is based on direct couple analysis that includes electrical, thermal and structural fields. The time to failure life predictions due to mass migration have been simulated based on the voids, current density, temperature and mechanical stress distribution. Numerical simulation has shown that the failure life of the electronic migration under the interaction of high direct current density, thermal loads and mechanical loads is far smaller than that of the electric-thermal coupling migration without considering stress-migration
Keywords :
electromigration; finite element analysis; flip-chip devices; reliability; solders; 3D finite element model; current density; direct couple analysis; electromigration; electronic migration; flip chip solder joint; mechanical load; mechanical stress distribution; numerical simulation; solder joint reliability study; stress-migration; temperature distribution; thermal load; Algorithm design and analysis; Current density; Electromigration; Finite element methods; Flip chip solder joints; Predictive models; Soldering; Temperature distribution; Testing; Thermal loading;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
Type :
conf
DOI :
10.1109/ICEPT.2006.359650
Filename :
4199008
Link To Document :
بازگشت