Micro IC probe for LSI testing

Author

Ito, T. ; Sawada, R. ; Higurashi, E.

Author_Institution

NTT Opto-Electron. Labs., Tokyo, Japan

fYear

1999

fDate

21-21 Jan. 1999

Firstpage

263

Lastpage

266

Abstract

A micro IC probe, which is a small elastic electrical contact, has been developed to improve LSI testing and reduce its cost. No larger than 300 /spl mu/m/spl times/80 /spl mu/m, it is fabricated with a pitch of 100 /spl mu/m by micromachining techniques. Its contact resistance is less than 0.5 /spl Omega/, satisfying the requirements for conventional probes, and its compliance is 2-8 /spl mu/m to accommodate height differences between LSI pads while maintaining contact with them.

Keywords

contact resistance; electrical contacts; integrated circuit testing; large scale integration; micromachining; multichip modules; photoresists; probes; sputter etching; 0.5 ohm; 300 micron; 80 micron; LSI testing; MCM known good dies selection; compliance; contact resistance; electroplating; height differences between LSI pads; micro IC probe; micromachining; photoresist patterning; plasma etching; small elastic electrical contact; Anisotropic magnetoresistance; Circuit testing; Etching; Integrated circuit testing; Large scale integration; Magnetic anisotropy; Perpendicular magnetic anisotropy; Polyimides; Probes; Resists;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on

Conference_Location

Orlando, FL, USA

ISSN

1084-6999

Print_ISBN

0-7803-5194-0

Type

conf

DOI

10.1109/MEMSYS.1999.746830

Filename

746830