Title :
Bump Thermal Management Analysis of LED with Flipchip Package
Author :
Sizong, Min ; Junhui, Li ; Ji-an, Duan ; Guiling, Deng
Author_Institution :
Coll. of Mech. & Electr. Eng., Central South Univ. of China, Hunan
Abstract :
LED solid state lighting (SSL) has a good prospects, but there are some bottlenecks, the one is that efficiency of light emitting is not enough for general lighting, the other is too much heat generated by higher power which affect the efficiency and life of LED. Flipchip´s applying is good for improvement of efficiency of light emitting of LED and especially for thermal management. The effect of the layout and the number of bumps of LED flipchip to thermal management of LED light was analyzed by using FEM simulation. The results show that better effect of thermal management can get after optimizing layout of bumps, and also show that the more bump number used the better thermal management can get, but there is a best optimal number as there are some other limiting factors such as structure and cost
Keywords :
finite element analysis; flip-chip devices; light emitting diodes; thermal management (packaging); FEM simulation; LED; bump thermal management analysis; flipchip package; general lighting; solid state lighting; Costs; Energy management; LED lamps; Light emitting diodes; Packaging; Power generation; Solid state lighting; Thermal engineering; Thermal factors; Thermal management;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359651
