Bump Thermal Management Analysis of LED with Flipchip Package

Author

Sizong, Min ; Junhui, Li ; Ji-an, Duan ; Guiling, Deng

Author_Institution

Coll. of Mech. & Electr. Eng., Central South Univ. of China, Hunan

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

7

Abstract

LED solid state lighting (SSL) has a good prospects, but there are some bottlenecks, the one is that efficiency of light emitting is not enough for general lighting, the other is too much heat generated by higher power which affect the efficiency and life of LED. Flipchip´s applying is good for improvement of efficiency of light emitting of LED and especially for thermal management. The effect of the layout and the number of bumps of LED flipchip to thermal management of LED light was analyzed by using FEM simulation. The results show that better effect of thermal management can get after optimizing layout of bumps, and also show that the more bump number used the better thermal management can get, but there is a best optimal number as there are some other limiting factors such as structure and cost

Keywords

finite element analysis; flip-chip devices; light emitting diodes; thermal management (packaging); FEM simulation; LED; bump thermal management analysis; flipchip package; general lighting; solid state lighting; Costs; Energy management; LED lamps; Light emitting diodes; Packaging; Power generation; Solid state lighting; Thermal engineering; Thermal factors; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359651

Filename

4199009