• DocumentCode
    2577973
  • Title

    Tantalum oxide thin films as protective coatings for sensors

  • Author

    Christensen, C. ; de Reus, R. ; Bouwstra, S.

  • Author_Institution
    Mikroelektronik Centret, Tech. Univ. Denmark, Lyngby, Denmark
  • fYear
    1999
  • fDate
    21-21 Jan. 1999
  • Firstpage
    267
  • Lastpage
    272
  • Abstract
    Reactively sputtered tantalum oxide thin-films have been investigated as protective coating for aggressive media exposed sensors. Tantalum oxide is shown to be chemically very robust. The etch rate in aqueous potassium hydroxide with pH 11 at 140/spl deg/C is lower than 0.008 /spl Aring//h. Etching in liquids with pH values in the range from pH 2-11 have generally given etch rates below 0.04 /spl Aring//h. On the other hand patterning is possible in hydrofluoric acid. Further, the passivation behaviour of amorphous tantalum oxide and polycrystalline Ta/sub 2/O/sub 5/ is different in buffered hydrofluoric acid. By ex-situ annealing in O/sub 2/ the residual thin-film stress can be altered from compressive to tensile and annealing at 450/spl deg/C for 30 minutes gives a stress-free film. The step coverage of the sputter deposited amorphous tantalum oxide is reasonable, but metallisation lines are hard to cover. Sputtered tantalum oxide exhibits high dielectric strength and the pinhole density for 0.5 /spl mu/m thick films is below 3 cm/sup -2/.
  • Keywords
    annealing; corrosion protective coatings; etching; internal stresses; microsensors; passivation; pressure sensors; semiconductor device packaging; sputtered coatings; tantalum compounds; 0.5 micron; 140 C; 450 C; Ta/sub 2/O/sub 5/; aggressive media exposed sensors; amorphous tantalum oxide; buffered hydrofluoric acid; compressive stress; etch rate; ex-situ annealing; high dielectric strength; microsensor protective coatings; packaging; passivation behaviour; patterning; pinhole density; polycrystalline tantalum oxide; pressure sensor; reactively sputtered thin films; residual thin-film stress; step coverage; stress-free film; tensile stress; Amorphous materials; Annealing; Chemical sensors; Coatings; Protection; Sputter etching; Sputtering; Tensile stress; Thin film sensors; Thin films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5194-0
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1999.746832
  • Filename
    746832