Title :
Research on Creep Properties of SnAgCuRE Lead-Free Soldered Joints
Author :
Zhang, Keke ; Yang, Jie ; Wang, Yaoli ; Fan, Yanli ; Zhang, Xin ; Yan, Yanfu
Author_Institution :
Mater. Sci. & Eng. Coll., Henan Univ. of Sci. & Technol., Luoyang
Abstract :
The creep properties and its rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints were separately investigated and forecasted under constant temperature by the means of single shear lap creep specimens and finite element method. The experiments show that the creep rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints can obviously increase with adding 0.1wt % RE, which is 8.4 times longer than that of Sn2.5Ag0.7Cu solder and is apparently higher than that of present commercial employed Sn3.8Ag0.7Cu solder. And the actual testing results of creep rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints are better in accord with the predicted results by finite element method
Keywords :
copper alloys; creep; finite element analysis; silver alloys; solders; tin alloys; SnAgCu; finite element method; lead-free soldered joints; single shear lap creep specimens; Automatic testing; Creep; Electronic equipment testing; Environmentally friendly manufacturing techniques; Finite element methods; Lead; Life testing; Raw materials; Soldering; Surface-mount technology; creep properties; finite element method; lead-free solder;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359657
