Research on Creep Properties of SnAgCuRE Lead-Free Soldered Joints

Author

Zhang, Keke ; Yang, Jie ; Wang, Yaoli ; Fan, Yanli ; Zhang, Xin ; Yan, Yanfu

Author_Institution

Mater. Sci. & Eng. Coll., Henan Univ. of Sci. & Technol., Luoyang

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

3

Abstract

The creep properties and its rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints were separately investigated and forecasted under constant temperature by the means of single shear lap creep specimens and finite element method. The experiments show that the creep rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints can obviously increase with adding 0.1wt % RE, which is 8.4 times longer than that of Sn2.5Ag0.7Cu solder and is apparently higher than that of present commercial employed Sn3.8Ag0.7Cu solder. And the actual testing results of creep rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints are better in accord with the predicted results by finite element method

Keywords

copper alloys; creep; finite element analysis; silver alloys; solders; tin alloys; SnAgCu; finite element method; lead-free soldered joints; single shear lap creep specimens; Automatic testing; Creep; Electronic equipment testing; Environmentally friendly manufacturing techniques; Finite element methods; Lead; Life testing; Raw materials; Soldering; Surface-mount technology; creep properties; finite element method; lead-free solder;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359657

Filename

4199015