• DocumentCode
    2578074
  • Title

    Effect of holes and edges on the squeeze film damping of perforated micromechanical structures

  • Author

    Eung-Sam Kim ; Young-Ho Cho ; Moon-Uhn Kim

  • Author_Institution
    Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
  • fYear
    1999
  • fDate
    21-21 Jan. 1999
  • Firstpage
    296
  • Lastpage
    301
  • Abstract
    This paper investigates the squeeze film damping of a perforated planar micromechanical structure that oscillates in the normal direction to the substrate. Special focus has been placed on the size and number of perforations influencing the squeeze film damping. Theoretical models and test structures of the squeeze film damping have been developed for the transversely oscillating perforated plates. A set of nine different test structures, having three different sizes with three different numbers of perforations, has been fabricated and tested. The experimental Q-factors, measured from the fabricated test structures, are compared with the theoretical values, estimated from finite element analysis. It is found that the finite element analysis overestimates the Q-factors up to 150% of the experimental values. Major discrepancy comes from the inaccuracy of the zero pressure condition, placed by the finite element analysis along the perforated edges.
  • Keywords
    Q-factor; damping; dynamic response; finite element analysis; micromechanical resonators; semiconductor device models; Navier-Stokes equation; Q-factors; edges effect; finite element analysis; holes effect; linear system model; number of perforations; perforated micromechanical structures; planar micromechanical structure; squeeze film damping; transversely oscillating perforated plates; zero pressure condition; Atmospheric measurements; Damping; Finite element methods; Frequency; Mechanical engineering; Micromechanical devices; Microstructure; Resonance; Substrates; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5194-0
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1999.746841
  • Filename
    746841