Title :
SPC System Analysis and Design of Reflow Soldering Process
Author :
Li, Chun-quan ; Wu, Zhao-hua
Author_Institution :
Dept. of Electron. Machinery & Traffic Eng., Guilin Univ. of Electron. Technol.
Abstract :
The reflow soldering process is the key process of SMT. Available control of reflow soldering process is the important process to ensure the SMT product quality and reliability. In this paper, taking reflow soldering process as the object, the SPC system of reflow soldering process is built; the process controlling project is designed; the choice of controlling variable, data collecting and SPC control policy for the reflow soldering process are analyzed; especially the design and realization of SPC control graph is explained. The study has advanced actively the level and capability of reflow soldering process
Keywords :
electronic engineering computing; process control; production engineering computing; reflow soldering; statistics; surface mount technology; SMT; SPC control policy; SPC system analysis; controlling variable; data collecting; process controlling project; reflow soldering process; statistics process control; Control systems; Electric variables control; Hardware; Process control; Production; Reflow soldering; Surface-mount technology; System analysis and design; Temperature control; Temperature sensors;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359659
