DocumentCode
2578206
Title
Development on Semiconductor Packaging and Testing Industry in China
Author
Bi, Keyun
Author_Institution
China Acad. of Electron. & Inf. Technol., Beijing
fYear
2006
fDate
26-29 Aug. 2006
Firstpage
1
Lastpage
2
Abstract
China Electronics Packaging Society (CEPS) has organized several international conferences on electronics packaging technology and several small-scale proseminars to build a bridge for the people engaged in packaging industry home and abroad, so much so that it will play a helpful role in promoting China electronic packaging development and international cooperation & technical exchange.
Keywords
integrated circuit packaging; integrated circuit testing; semiconductor technology; China Electronics Packaging Society; IC testing; electronic packaging development; microelectronics packaging; semiconductor industry development; semiconductor packaging; semiconductor testing industry; Electronic equipment testing; Electronics industry; Electronics packaging; Integrated circuit packaging; Marketing and sales; Production; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor device testing; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0619-6
Electronic_ISBN
1-4244-0620-X
Type
conf
DOI
10.1109/ICEPT.2006.359665
Filename
4199023
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