Title :
Development on Semiconductor Packaging and Testing Industry in China
Author_Institution :
China Acad. of Electron. & Inf. Technol., Beijing
Abstract :
China Electronics Packaging Society (CEPS) has organized several international conferences on electronics packaging technology and several small-scale proseminars to build a bridge for the people engaged in packaging industry home and abroad, so much so that it will play a helpful role in promoting China electronic packaging development and international cooperation & technical exchange.
Keywords :
integrated circuit packaging; integrated circuit testing; semiconductor technology; China Electronics Packaging Society; IC testing; electronic packaging development; microelectronics packaging; semiconductor industry development; semiconductor packaging; semiconductor testing industry; Electronic equipment testing; Electronics industry; Electronics packaging; Integrated circuit packaging; Marketing and sales; Production; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor device testing; Semiconductor materials;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359665
