DocumentCode :
2578241
Title :
A novel fabrication method of the tiny aperture tip on silicon cantilever for near field scanning optical microscopy
Author :
Minh, P.N. ; Ono, T. ; Esashi, M.
Author_Institution :
Fac. of Eng., Tohoku Univ., Sendai, Japan
fYear :
1999
fDate :
21-21 Jan. 1999
Firstpage :
360
Lastpage :
365
Abstract :
In this paper we present a novel fabrication method of a miniature aperture on a Si cantilever for Near field Scanning Optical Microscopy (NSOM). The Si cantilever with a SiO/sub 2/ pyramidal tip was microfabricated in a batch process. The silicon was thermally oxidized at low temperature (1050/spl deg/C). Due to the effect of locally compressive intrinsic stress within the oxide on the solubility of oxygen, the thermal silicon oxide at the bottom of the pyramidal etch pit is thinner. Thus, a tiny aperture can be created by partly etching the SiO/sub 2/ in buffered HF solution. Using the etching method aperture size ranging from 150 nm to 500 nm have been experimental realized. By optimizing the SiO/sub 2/ etching time, sub 100 nm size apertures are feasible using the fabrication method. The fabricated probe was mounted to an Atomic Force Microscope (AFM) head. The AFM in contact mode and corresponding NSOM images of Au patterns on Si wafer were simultaneously recorded.
Keywords :
atomic force microscopy; elemental semiconductors; etching; internal stresses; micro-optics; near-field scanning optical microscopy; optical fabrication; oxidation; silicon; solubility; 1050 C; 150 to 500 nm; Si; SiO/sub 2/; SiO/sub 2/ pyramidal tip; aperture fabrication; atomic force microscope; batch microfabrication; contact mode; etching; intrinsic stress; near field scanning optical microscopy; oxygen solubility; silicon cantilever; thermal oxidation; Apertures; Atomic force microscopy; Compressive stress; Etching; Optical buffering; Optical device fabrication; Optical microscopy; Silicon; Temperature; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
Conference_Location :
Orlando, FL, USA
ISSN :
1084-6999
Print_ISBN :
0-7803-5194-0
Type :
conf
DOI :
10.1109/MEMSYS.1999.746855
Filename :
746855
Link To Document :
بازگشت