• DocumentCode
    2578684
  • Title

    The 300mm Technology Current Status And Future Prospect

  • Author

    Komiya, H.

  • Author_Institution
    Semiconductor Leading Edge Technologies, Inc. 292 Yoshida+ho, Totsuka-ku, Yokohama-shi, Japan
  • fYear
    1997
  • fDate
    10-12 June 1997
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Development of the 300¿ technology is approaching the exciting part of the program. The transition in the wafer diameter fiom 200¿ to 300¿ is expected to result in the chip cost reduction by the range of 1.520% and to decrease the investment in the production line down to about 65%. The technological key issues would be the crystal growth and the heat treatment. World-wide cooperative efforts are being made for the evaluation of the equipment and materials and for the standardiition.
  • Keywords
    Semiconductor devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on
  • Print_ISBN
    4-930813-75-1
  • Type

    conf

  • DOI
    10.1109/VLSIT.1997.623667
  • Filename
    623667
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2578684