Title :
Fabrication of nickel electroplated cantilever-type MEMS probe card with through-hole interconnection
Author :
Bong-Hwan Kim ; Sang-Jun Park ; Dong-Il Cho ; Kukjin Chun
Author_Institution :
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Abstract :
In this paper, a new cantilever type MEMS probe card for IC testing was developed. The probe was fabricated with silicon substrate.
Keywords :
contact resistance; electroplating; integrated circuit testing; leakage currents; micromechanical devices; nickel; probes; IC testing; Ni; Si; hole interconnection; nickel electroplated cantilever-type MEMS probe card; silicon substrate; Circuit testing; Copper; Etching; Fabrication; Integrated circuit interconnections; Integrated circuit testing; Micromechanical devices; Nickel; Probes; Silicon;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-040-2
DOI :
10.1109/IMNC.2003.1268629
