Title :
Fabrication of 3-Dimensional Cu coaxial cable using porous silicon MEMS technology
Author :
Duk-Soo Eun ; Young-Min Kim ; Su-Lack Jung ; Jang-Kyoo Shin ; Jong-Hyun Lee
Author_Institution :
Sch. of Electron. & Electr. Eng., Kyungpook Nat. Univ., Taegu, South Korea
Abstract :
In this paper we study the fabrication of 3-dimensional Cu coaxial cable by HNA etching, porous silicon micromachining and copper plating.
Keywords :
coaxial cables; copper; electroplating; etching; metallic thin films; micromachining; 3D Cu coaxial cable; Cu; Si; copper plating; etching; porous silicon MEMS technology; porous silicon micromachining; Coaxial cables; Copper; Dielectric losses; Dielectric substrates; Electrodes; Etching; Fabrication; Machining; Micromechanical devices; Silicon;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-040-2
DOI :
10.1109/IMNC.2003.1268630
